- cross-posted to:
- android@lemdro.id
- cross-posted to:
- android@lemdro.id
- limerodOPEnglish2·4 days ago
- Samsung is reportedly working on a new cooling solution for future Exynos smartphone processors.
- This packaging tech is apparently derived from PCs and servers and sees a type of heatsink attached to the top of the processor.
- Work on the tech could be completed by Q4 2024, suggesting the Exynos 2500 could potentially use it.